Wafer precision cleaning machine - メーカー・企業と製品の一覧

[Device Production Example] Cleaning Device

The number of processing chambers is 1 to 4! The wafer materials are SiC, Si, GaAs, GaN, glass, and LT substrates.

We would like to introduce a case study of our "Precision Cleaning Equipment." This equipment is used for cleaning precision components such as semiconductor wafers and hard disks, employing a batch format to remove contamination from particles, chemicals, and metals. Since it cleans wafers one by one, it is suitable for small-batch production of various types and high-functionality cleaning. 【Product Specifications】 ■ Semiconductor wafers (SiC, GaN, silicon, sapphire, etc.), MEMS ■ Wafer materials: SiC, Si, GaAs, GaN, glass, LT substrates ■ Wafer sizes: 2 to 12 inches ■ Number of processing chambers: 1 to 4 ■ Chemicals: Up to 2 types (optional: 3 types) *For more details, please download the PDF or feel free to contact us.

• 企業：シナノ精機
• 価格：Other

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